Accessories
A small upgrade, a big difference.
Tyvok X1/X1S Laser-Leistungs-Upgrade-Kit 40W/60W
From $859.00
$1,399.00
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Tyvok - Spider Lasermodul 20W/40W/60W/2W Infrarot
From $399.00
$1,100.00
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Tyvok - Spider 60W Lasermodul
$999.00
$1,400.00
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Tyvok - 2W Infrarot-Lasermodul
$399.00
$599.00
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Tyvok Lasergravur-Flexible Wabenplattenklemme
$9.99
$20.00
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Tyvok Lasergravur Flexible Waben-Arbeitsplatte
From $39.90
$49.90
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Tyvok – Elektrischer Präzisions-Gravierstift
From $29.00
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Tyvok - Touchscreen-Kit für Spider X1S Pro
From $9.90
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Tyvok - Flexible Waben-Arbeitsplatte
From $39.99
$49.90
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Tyvok - Holzfräse
$69.00
$89.00
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Tyvok – Premium-Materialpaket für Lasergravierer
$39.99
$49.00
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TYVOK - Hundeschmuck aus Metall
From $49.00
$50.00
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4 Produkte
Choose by finished project, not only by laser power
Use this laser engraver collection to compare compact gift work, large-format signs, acrylic display jobs, and repeat shop layouts before opening a product page.
Buying guide
Pick by material, work area, and business use. Machine selector
Compare P2, P2 Ultra, X1S, X1S Pro, and K1. Material settings
Start with wood, leather, acrylic, and metal tests.
Pick by material, work area, and business use. Machine selector
Compare P2, P2 Ultra, X1S, X1S Pro, and K1. Material settings
Start with wood, leather, acrylic, and metal tests.
Common TYVOK laser engraver paths
P2 fits fast small gifts and tags. X1S fits larger signs and panels. X1S Pro supports repeat layouts. K1 is the CO2 path for acrylic and studio cutting workflows.
Shop by real workflow
TYVOK X1S Series for large-format signs and panels
Choose this path when the product is physically larger than a desktop gift machine can handle cleanly. Start from the finished product, then compare the TYVOK machine path that fits the job.
Large-format startX1S 2026Start at 800 x 800mm and plan toward 800 x 2000mm signs, decor panels, and long layouts.
Workspace supportExtension kitFor longer boards, larger panels, and fewer alignment steps.
More power60W upgradeFor thicker materials, faster cutting tests, and future capability growth.
